Resin grinding wheel with the rapid development of electronics, machinery, optics and other industries. For the processing of hard and brittle materials such as single crystal silicon, stainless steel and cemented carbide. Surface quality and processing efficiency put forward higher and higher requirements. Even facing some challenges, technological products are not innovative. Product energy saving and emission reduction are restricting its development.
Divide according to abrasive. Grinding wheel can be divided into ordinary abrasive (corundum and silicon carbide, etc.) grinding wheel. Natural abrasive superabrasives and (diamond and cubic boron nitride, etc.) grinding wheels.
Sort by shape. Grinding wheel can be divided into flat grinding wheel, cylindrical grinding wheel, bevel grinding wheel, dish grinding wheel, etc.
According to the binding agent. Grinding wheel can be divided into metal grinding wheel, rubber grinding wheel, resin grinding wheel, ceramic grinding wheel, etc.
Grinding wheel and grinding technology affect the machining quality of engineering ceramics machining cost and its application. Semiconductor silicon chip materials such as grinding technology and quality affect the further development of the computer and the development of the information technology industry. Therefore, grinding wheels and their grinding are widely used in various industries. Technological progress and the entire national economy play an important role.